Current techniques used for the production of individual hohlraum components require single-point ultra-precision machining. In an effort to reduce cost and time, mass-production techniques adopted from the Microelectronics sector have been developed. These Microengineering processes will allow a variety of materials to be investigated with various geometrical features and surface topographies. Using thick photosensitive polymers, combined with electroplating processes, complex 3-D structures can be fabricated in multiple stages. In this review the production of a hohlraum end-cap used for indirect inertial confinement fusion (ICF) is presented as an example of this procedure.