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Division members promote the advancement of mathematical and computational methods for solving problems arising in all disciplines encompassed by the Society. They place particular emphasis on numerical techniques for efficient computer applications to aid in the dissemination, integration, and proper use of computer codes, including preparation of computational benchmark and development of standards for computing practices, and to encourage the development on new computer codes and broaden their use.
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2024 ANS Annual Conference
June 16–19, 2024
Las Vegas, NV|Mandalay Bay Resort and Casino
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Latest News
College students help develop waste-measuring device at Hanford
A partnership between Washington River Protection Solutions (WRPS) and Washington State University has resulted in the development of a device to measure radioactive and chemical tank waste at the Hanford Site. WRPS is the contractor at Hanford for the Department of Energy’s Office of Environmental Management.
K. Nam et al.
Fusion Science and Technology | Volume 64 | Number 2 | August 2013 | Pages 131-135
ITER | Proceedings of the Twentieth Topical Meeting on the Technology of Fusion Energy (TOFE-2012) (Part 1), Nashville, Tennessee, August 27-31, 2012 | doi.org/10.13182/FST13-A18067
Articles are hosted by Taylor and Francis Online.
This paper describes the fabrication of removable panel for ITER cryostat thermal shield (CTS) and its conduction cooling test at cryogenic temperature. Two kinds of full-scale mock-ups of the removable panels have been developed, depending on different thermal conduction designs. Passive cooling characteristics of the mock-ups are investigated with the measured data of temperature jump at the joint and maximum temperature at the panel. The passive cooling of panel with copper insertion satisfies the design requirement of temperature jump (< 3 K), even though the heat load condition in the cooling test is more severe than the design condition of CTS. It is clearly demonstrated that the copper strips bonded on the panel attenuate the temperature gradient of the panel. Different thermal behaviors at the joint are also found for the two mock-ups.