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Division Spotlight
Thermal Hydraulics
The division provides a forum for focused technical dialogue on thermal hydraulic technology in the nuclear industry. Specifically, this will include heat transfer and fluid mechanics involved in the utilization of nuclear energy. It is intended to attract the highest quality of theoretical and experimental work to ANS, including research on basic phenomena and application to nuclear system design.
Meeting Spotlight
2024 ANS Annual Conference
June 16–19, 2024
Las Vegas, NV|Mandalay Bay Resort and Casino
Standards Program
The Standards Committee is responsible for the development and maintenance of voluntary consensus standards that address the design, analysis, and operation of components, systems, and facilities related to the application of nuclear science and technology. Find out What’s New, check out the Standards Store, or Get Involved today!
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Latest News
NWMO to select Canadian repository site this year
Canada’s Nuclear Waste Management Organization, a not-for-profit organization responsible for the long-term management of the country’s intermediate- and high-level radioactive waste, is set to select a site for a deep geologic repository by the end of the year.
K. Nam et al.
Fusion Science and Technology | Volume 64 | Number 2 | August 2013 | Pages 131-135
ITER | Proceedings of the Twentieth Topical Meeting on the Technology of Fusion Energy (TOFE-2012) (Part 1), Nashville, Tennessee, August 27-31, 2012 | doi.org/10.13182/FST13-A18067
Articles are hosted by Taylor and Francis Online.
This paper describes the fabrication of removable panel for ITER cryostat thermal shield (CTS) and its conduction cooling test at cryogenic temperature. Two kinds of full-scale mock-ups of the removable panels have been developed, depending on different thermal conduction designs. Passive cooling characteristics of the mock-ups are investigated with the measured data of temperature jump at the joint and maximum temperature at the panel. The passive cooling of panel with copper insertion satisfies the design requirement of temperature jump (< 3 K), even though the heat load condition in the cooling test is more severe than the design condition of CTS. It is clearly demonstrated that the copper strips bonded on the panel attenuate the temperature gradient of the panel. Different thermal behaviors at the joint are also found for the two mock-ups.