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2025 ANS Winter Conference & Expo
November 9–12, 2025
Washington, DC|Washington Hilton
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The Standards Committee is responsible for the development and maintenance of voluntary consensus standards that address the design, analysis, and operation of components, systems, and facilities related to the application of nuclear science and technology. Find out What’s New, check out the Standards Store, or Get Involved today!
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Fusion Science and Technology
Latest News
U.K.’s NWS gets input from young people on geological disposal
Nuclear Waste Services, the radioactive waste management subsidiary of the United Kingdom’s Nuclear Decommissioning Authority, has reported on its inaugural year of the National Youth Forum on Geological Disposal forum. NWS set up the initiative, in partnership with the environmental consultancy firm ARUP and the not-for-profit organization The Young Foundation, to give young people the chance to share their views on the government’s plans to develop a geological disposal facility (GDF) for the safe, secure, and long-term disposal of radioactive waste.
Matthew J. Bono, George Q. Langstaff, Octavio Cervantes, Craig M. Akaba, Steven R. Strodtbeck, Alex V. Hamza, Nick E. Teslich, Ronald J. Foreman, Johann P. Lotscher, Gregory W. Nyce, Ralph H. Page, Thomas R. Dittrich, Gail Glendinning
Fusion Science and Technology | Volume 55 | Number 3 | April 2009 | Pages 318-324
Technical Paper | Eighteenth Target Fabrication Specialists' Meeting | doi.org/10.13182/FST08-3450
Articles are hosted by Taylor and Francis Online.
Targets were fabricated at Lawrence Livermore National Laboratory and were shot on the Omega laser to study the equation of state of nanoporous copper. The targets had a planar configuration and consisted of a 25-m-thick beryllium ablator, a 70-m-thick brominated-polystyrene preheat shield, and a 38-m-thick aluminum baseplate. A quartz window and a 30-m-thick nanoporous copper sample were bonded to the baseplate. The interface between the nanoporous copper and the aluminum baseplate was required to be as thin as possible so that it would not disturb the shock as it passed through the target. A process for bonding the nanoporous copper was developed that did not compact it or otherwise degrade its structure. An acceptable bond was achieved by sputtering a layer of indium-based solder onto the surface of the nanoporous copper and on the aluminum baseplate. The components were assembled and heated to melt the solder. The resulting solder interface had a thickness of ~1.5 m. The targets performed as expected in the experiments, and the interface between the nanoporous copper and the baseplate did not appear to significantly affect the shock as it passed through the target.