Electroplating remains an attractive deposition approach for fabricating metal microspherical targets for inertial confinement fusion because of its relatively fast deposition rates and ability to produce full-density small grain coatings. Here, we discuss recent advances that allow for coating thick (>60 µm) leak-free gold capsules and capsules with gradients of gold and silver. We present a new apparatus used for electroplating hollow microspherical (typically 2-mm diameter) mandrels and discuss the resulting surface roughness and sphericity obtained using this plating method.