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Second round of Launch Pad selections includes eight newcomers
The National Reactor Innovation Center at Idaho National Laboratory has announced 13 project selections across 12 companies for the Nuclear Energy Launch Pad, a Department of Energy–led program that integrates reactor and fuel facility authorization, testing, and deployment support for private nuclear developers.
The Launch Pad emerged from the Reactor Pilot Program and Fuel Line Pilot Program.
According to INL, projects selected include reactor development and nuclear fuel cycle advancements, including fabrication, enrichment, and conversion technologies.
Fuqiang Wang, Jian Chen, Hong Cui, Alin Ji, Dong Xie, Zhaofu Zhang
Fusion Science and Technology | Volume 78 | Number 3 | April 2022 | Pages 243-252
Technical Paper | doi.org/10.1080/15361055.2021.1978743
Articles are hosted by Taylor and Francis Online.
The coating technology of tungsten on carbon/carbon (C/C) composite is an important issue for fusion experimental device components. In this study, an interlayer of chemical vapor deposition SiC between tungsten coating and C/C substrate was used. A tungsten coating 320 μm thick was successfully deposited on SiC-coated C/C substrate by inert plasma spray. The microstructure, roughness, and constituents of W-SiC-C/C composite materials were investigated using a scanning electron microscope, energy dispersive X-ray spectroscope, X-ray diffractometer, and atomic force microscope. The tungsten coating structure that may prevent crack propagation essentially consisted of a stacked lamellar columnar microstructure and particle cluster microstructures. The interfaces between the tungsten and SiC coating and between the SiC coating and the C/C were clear. The SiC interlayer acts as a barrier for carbon and tungsten diffusion. The thermal conductivity of the system was calculated by the mixture rule, which was 47.33 to 82.35 W/(m·K). The thermal expansion coefficient of W-SiC-C/C was negative at room temperature and up to 1.5 × 10−6/K for elevated temperature.