ANS is committed to advancing, fostering, and promoting the development and application of nuclear sciences and technologies to benefit society.
Explore the many uses for nuclear science and its impact on energy, the environment, healthcare, food, and more.
Division Spotlight
Reactor Physics
The division's objectives are to promote the advancement of knowledge and understanding of the fundamental physical phenomena characterizing nuclear reactors and other nuclear systems. The division encourages research and disseminates information through meetings and publications. Areas of technical interest include nuclear data, particle interactions and transport, reactor and nuclear systems analysis, methods, design, validation and operating experience and standards. The Wigner Award heads the awards program.
Meeting Spotlight
2024 ANS Annual Conference
June 16–19, 2024
Las Vegas, NV|Mandalay Bay Resort and Casino
Standards Program
The Standards Committee is responsible for the development and maintenance of voluntary consensus standards that address the design, analysis, and operation of components, systems, and facilities related to the application of nuclear science and technology. Find out What’s New, check out the Standards Store, or Get Involved today!
Latest Magazine Issues
Apr 2024
Jan 2024
Latest Journal Issues
Nuclear Science and Engineering
May 2024
Nuclear Technology
Fusion Science and Technology
Latest News
55th annual Nuclear News Buyers Guide now available
For American Nuclear Society members and Nuclear News subscribers, the 2024 Buyers Guide is now available in the ANS Digital Nuclear Library. The print version will be mailed along with the May “Capacity Factors/Nuclear Security” issue of Nuclear News magazine.
The corresponding ANS online Buyers Guide database is available year-round to all readers—updated with the latest products, services, and suppliers contact information for more than 600 nuclear-related companies.
S. X. Zhao, Q. Li, W. J. Wang, C. Li, D. D. Zhang, R. Wei, S. G. Qin, Y. L. Shi, L. J. Peng, N. J. Pan, Y. Xu, G. H. Liu, T. J. Wang, D. M. Yao, G.-N. Luo
Fusion Science and Technology | Volume 67 | Number 4 | May 2015 | Pages 784-791
Technical Paper | doi.org/10.13182/FST14-835
Articles are hosted by Taylor and Francis Online.
A hot isostatic pressing (HIP) route has been developed by the Institute of Plasma Physics of the Chinese Academy of Sciences in collaboration with the Advanced Technology & Materials Co., Ltd. for bonding W/Cu tiles to Ni-electroplated CuCrZr heat sinks. During high-heat-flux testing, in the initial stage, Cu/Ni interfacial debonding was observed. Careful analyses indicated that interfacial oxidation during encapsulation for HIP processing using tungsten inert gas (TIG) welding was the main cause of the limited fatigue lifetime. Copper oxides formed during the TIG encapsulation do not decompose during HIP at 600°C. As a result, weak bonding and even some microcracks were generated, and unfortunately these microcracks could not be detected by current industrial ultrasonic probes. An oxidation-free encapsulation technique, suitable for batch processing, has been developed to achieve a thermal fatigue lifetime of more than 1000 cycles at a heat load of 5 MW/m2 for the components.