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Conference Spotlight
2025 ANS Winter Conference & Expo
November 8–12, 2025
Washington, DC|Washington Hilton
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The Standards Committee is responsible for the development and maintenance of voluntary consensus standards that address the design, analysis, and operation of components, systems, and facilities related to the application of nuclear science and technology. Find out What’s New, check out the Standards Store, or Get Involved today!
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Fusion Science and Technology
Latest News
Japan gets new U for enrichment as global power and fuel plans grow
President Trump is in Japan today, with a visit with new Prime Minister Sanae Takaichi on the agenda. Takaichi, who took office just last week as Japan’s first female prime minister, has already spoken in favor of nuclear energy and of accelerating the restart of Japan’s long-shuttered power reactors, as Reuters and others have reported. Much of the uranium to power those reactors will be enriched at Japan’s lone enrichment facility—part of Japan Nuclear Fuel Ltd.’s Rokkasho fuel complex—which accepted its first delivery of fresh uranium hexafluoride (UF₆) in 11 years earlier this month.
S. X. Zhao, Q. Li, W. J. Wang, C. Li, D. D. Zhang, R. Wei, S. G. Qin, Y. L. Shi, L. J. Peng, N. J. Pan, Y. Xu, G. H. Liu, T. J. Wang, D. M. Yao, G.-N. Luo
Fusion Science and Technology | Volume 67 | Number 4 | May 2015 | Pages 784-791
Technical Paper | doi.org/10.13182/FST14-835
Articles are hosted by Taylor and Francis Online.
A hot isostatic pressing (HIP) route has been developed by the Institute of Plasma Physics of the Chinese Academy of Sciences in collaboration with the Advanced Technology & Materials Co., Ltd. for bonding W/Cu tiles to Ni-electroplated CuCrZr heat sinks. During high-heat-flux testing, in the initial stage, Cu/Ni interfacial debonding was observed. Careful analyses indicated that interfacial oxidation during encapsulation for HIP processing using tungsten inert gas (TIG) welding was the main cause of the limited fatigue lifetime. Copper oxides formed during the TIG encapsulation do not decompose during HIP at 600°C. As a result, weak bonding and even some microcracks were generated, and unfortunately these microcracks could not be detected by current industrial ultrasonic probes. An oxidation-free encapsulation technique, suitable for batch processing, has been developed to achieve a thermal fatigue lifetime of more than 1000 cycles at a heat load of 5 MW/m2 for the components.
