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2026 Nuclear Energy Conference & Expo (NECX)
August 24–27, 2026
Dallas, TX|Hilton Anatole
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Fusion Science and Technology
August 2026
Latest News
Second round of Launch Pad selections includes eight newcomers
The National Reactor Innovation Center at Idaho National Laboratory has announced 13 project selections across 12 companies for the Nuclear Energy Launch Pad, a Department of Energy–led program that integrates reactor and fuel facility authorization, testing, and deployment support for private nuclear developers.
The Launch Pad emerged from the Reactor Pilot Program and Fuel Line Pilot Program.
According to INL, projects selected include reactor development and nuclear fuel cycle advancements, including fabrication, enrichment, and conversion technologies.
P. B. Mirkarimi, K. A. Bettencourt, N. E. Teslich, S. C. Peterson
Fusion Science and Technology | Volume 63 | Number 2 | March-April 2013 | Pages 282-287
Technical Paper | Selected papers from 20th Target Fabrication Meeting, May 20-24, 2012, Santa Fe, NM, Guest Editor: Robert C. Cook | doi.org/10.13182/FST13-TFM20-34
Articles are hosted by Taylor and Francis Online.
The equation of state (EOS) and other parameters at high pressures and low temperatures are of significant interest. One example is iron, where knowledge of the EOS at high pressure is needed to understand planetary interiors and planetary development. Targets are needed to perform these important measurements on experimental platforms such as Omega, National Ignition Facility (NIF), and the Z-machine. There is a need for thicker films for targets for the NIF and Z-machine platforms, which is technically challenging because of coating stress and other issues. We present results showing that we successfully sputter deposited stepped iron and tantalum films up to 90+ m thick for targets on NIF and have sputter deposited (unstepped) tantalum films over 1700 m (1.7 mm!) thick, which are desired for targets for Z-machine EOS experiments. This is generally made possible by the low stress achieved in the tantalum films (as low as 25 MPa). We will also report some process improvement achievements, such as a shaper roll-off for the Fe step edges, as well as some characterization results of the microstructure of the very thick films. For example, interruption of the growth with a brief ambient exposure appears to have a minor impact on the columnar grain growth.