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Radiation Protection & Shielding
The Radiation Protection and Shielding Division is developing and promoting radiation protection and shielding aspects of nuclear science and technology — including interaction of nuclear radiation with materials and biological systems, instruments and techniques for the measurement of nuclear radiation fields, and radiation shield design and evaluation.
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2024 ANS Annual Conference
June 16–19, 2024
Las Vegas, NV|Mandalay Bay Resort and Casino
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The Standards Committee is responsible for the development and maintenance of voluntary consensus standards that address the design, analysis, and operation of components, systems, and facilities related to the application of nuclear science and technology. Find out What’s New, check out the Standards Store, or Get Involved today!
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Fusion Science and Technology
Latest News
DOE issues final RFQ for WIPP clean energy initiative
The Department of Energy’s Office of Environmental Management has issued a request for qualifications for interested parties and prospective offerors looking to enter into a realty agreement for carbon-pollution-free electricity (CFE) projects at the department’s Waste Isolation Pilot Plant site in southeastern New Mexico.
K. J. M. Blobaum, M. Stadermann, J. E. Fair, N. E. Teslich, M. A. Wall, R. J. Foreman, N. Hein, H. Streckert, A. Nikroo
Fusion Science and Technology | Volume 63 | Number 2 | March-April 2013 | Pages 232-241
Technical Paper | Selected papers from 20th Target Fabrication Meeting, May 20-24, 2012, Santa Fe, NM, Guest Editor: Robert C. Cook | doi.org/10.13182/FST13-TFM20-32
Articles are hosted by Taylor and Francis Online.
Blistering and delamination are the primary failure mechanisms during the processing of depleted uranium (DU) hohlraums. These hohlraums consist of a sputter-deposited DU layer sandwiched between two sputter-deposited layers of gold; a final thick gold layer is electrodeposited on the exterior. The hohlraum is deposited on a copper-coated aluminum mandrel; the Al and Cu are removed with chemical etching after the gold and DU layers are deposited. After the mandrel is removed, blistering and delamination are observed on the interiors of some hohlraums, particularly at the radius region. It is hypothesized that blisters are caused by pinholes in the copper and gold layers; etchant leaking through these holes reaches the DU layer and causes it to oxidize, resulting in a blister. Depending on the residual stress in the deposited layers, blistering can initiate larger-scale delamination at layer interfaces. Scanning electron microscopy indicates that inhomogeneities in the machined aluminum mandrel are replicated in the sputter-deposited copper layer. Furthermore, the Cu layer exhibits columnar growth with pinholes that likely allow etchant to come in contact with the gold layer. Any inhomogeneities or pinholes in this initial gold layer then become nucleation sites for blistering. Using a focused ion beam system to etch through the gold layer and extract a cross-sectional sample for transmission electron microscopy, amorphous, intermixed layers at the gold/DU interfaces are observed. Nanometer-sized bubbles in the sputtered and electrodeposited gold layers are also present. Characterization of the morphology and composition of the deposited layers is the first step in determining modifications to processing parameters, with the goal of attaining a significant improvement in hohlraum yield.