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Uranium prices steady as EIA releases annual market report
The end-of-July spot price for uranium was $86.36 per pound, as reported by Cameco—roughly the same as it has been since February. Analytics firm Trading Economics reported a uranium futures price of $86.60 per pound, a figure that also has been holding steady since early April.
These updates come as the U.S. Energy Information Administration has released its 2025 Uranium Marketing Annual Report, which examines in detail multiple aspects of the U.S. uranium market. Data are derived from answers given in the Uranium Marketing Annual Survey, which collects information on contracts, deliveries (during the past year and projected for the next 10 years), purchased enrichment services, inventories, fuel assembly usage, and market requirements.
Y. Ueda, N. Ohno, S. Kajita, H. Kurishita, H. Iwakiri, K. Tokunaga, N. Yoshida
Fusion Science and Technology | Volume 52 | Number 3 | October 2007 | Pages 513-520
Technical Paper | The Technology of Fusion Energy - High Heat Flux Components | doi.org/10.13182/FST07-A1540
Articles are hosted by Taylor and Francis Online.
This paper reports Japanese activities on tungsten material development and the basic studies on plasma and tungsten interactions. Effects of helium ion irradiation on embrittlement and bubble formation of various tungsten materials have been intensively investigated in Japan. Details of the helium bubble formation mechanism, its effects on surface morphology ,and the impacts on dust formation are presented. Fine-grained and TiC fine-particles dispersed tungsten are being developed to increase the resistance of the material to degradation in the fusion reactor environment. Microstructures and specific features amenable to fusion environments are presented. The experimental results on repetitive heat pulses on surface roughening and cracking are shown. The repetitive heat pulse effects are very serious and further studies are needed. Important issues of tungsten material development for DEMO and commercial devices will be discussed.