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Conference Spotlight
2026 ANS Annual Conference
May 31–June 3, 2026
Denver, CO|Sheraton Denver
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Latest News
ORNL–General Atomics partnership on ceramic matrix composites
A memorandum of understanding has been signed by Oak Ridge National Laboratory and General Atomics Electromagnetic Systems (GA-EMS) with the objective of working together on advanced ceramic matrix composite materials for applications in extreme environments. Materials that can withstand extreme temperatures, radiation, corrosion, and mechanical stress are required in aerospace, defense, energy, and other sectors.
According to the agreement, the San Diego–based GA-EMS will use resources from ORNL’s Manufacturing Demonstration Facility to develop “scalable, efficient manufacturing techniques for extreme environment materials including precursors, fibers, composites, and coatings utilized in carbon/carbon (C/C), carbon/silicon carbide (C/SiC), and SiC/SiC composite systems.”
Technical Session|Sponsored by OPD
Wednesday, November 12, 2025|3:15–5:00PM EST|Cardozo
Session Chair:
Melanie Joseph
Alternate Chair:
Gale Hauck
Session Organizer:
William N. Mann
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Control of Once-Through Steam Generator During Turbine Power Ramp Change in i-SMR
3:15–3:35PM EST
Semin Joo (Korea Advanced Institute of Science & Technology), Jeong Ik Lee (KAIST)
Paper
Integrating Public Perspectives in Microreactor Facility Design
3:35–3:55PM EST
Diana Cambero Inda (Univ. Michigan), Armita Marpu (Univ. Michigan), Gina Rubio (Univ. Michigan), Caralyn Hass (Univ. Michigan), Prish Dhagat (Univ. Michigan), Katie Snyder (Univ. Michigan), Aditi Verma (Univ. Michigan)
Expanding Siting Methodology
3:55–4:15PM EST
Gale E. Hauck (Oak Ridge National Laboratory)
Examining Research Trends on the Integration of Safety, Security, and Safeguards through Literature Analysis
4:15–4:35PM EST
Minsuk Lee (Texas A&M University), Man-Sung Yim (TAMU)
Geospatial and Policy-Based Siting Case Studies of Advanced Nuclear Reactor and Data Center Colocation
4:35–4:55PM EST
Tanmay Deshmukh (Univ. Michigan), Aditi Verma (Univ. Michigan)
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