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Conference Spotlight
2025 ANS Winter Conference & Expo
November 9–12, 2025
Washington, DC|Washington Hilton
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Latest News
IAEA again raises global nuclear power projections
Noting recent momentum behind nuclear power, the International Atomic Energy Agency has revised up its projections for the expansion of nuclear power, estimating that global nuclear operational capacity will more than double by 2050—reaching 2.6 times the 2024 level—with small modular reactors expected to play a pivotal role in this high-case scenario.
IAEA director general Rafael Mariano Grossi announced the new projections, contained in the annual report Energy, Electricity, and Nuclear Power Estimates for the Period up to 2050 at the 69th IAEA General Conference in Vienna.
In the report’s high-case scenario, nuclear electrical generating capacity is projected to increase to from 377 GW at the end of 2024 to 992 GW by 2050. In a low-case scenario, capacity rises 50 percent, compared with 2024, to 561 GW. SMRs are projected to account for 24 percent of the new capacity added in the high case and for 5 percent in the low case.
Dongjune Chang, Youho Lee (Univ of New Mexico)
Proceedings | Advances in Thermal Hydraulics 2018 | Orlando, FL, November 11-15, 2018 | Pages 343-354
The research for packed Pebble-bed for Fluoride salt-cooled high temperature reactor, with its advantages of passive safety feature and higher thermal efficiency compared to conventional nuclear power plants, is developing actively by many research institutes. In this study, the authors introduce a new device which has non-invasive type measurements in order to figure out the statistical distribution of temperature and heat transfer performance of randomly packed spherical fuels. This device is made up with a metallic shell of 63.5mm diameter, and it contains a circuit board and battery to drive temperature measurements, wireless data transfer. The circuit board used for receive measured temperature from several K type thermocouples is based on the ATmega328 type Microprocessor (MCU). This board collects temperature at multiple points and send data to the receiver in a wireless way. The authors descript its communication protocol and driving method of the device. After that, the development process for configuring new concept wireless device was explained. In addition, heat generation from the inside of the spherical device was realized by using induction heating and fabric-based heating material. Preliminary results from the experiment on the wireless communication of multiple devices are presented. The statistical distribution of the local heat transfer coefficient for multiple packed-pebbles can be obtained by extending this preliminary experimental method.