ANS is committed to advancing, fostering, and promoting the development and application of nuclear sciences and technologies to benefit society.
Explore the many uses for nuclear science and its impact on energy, the environment, healthcare, food, and more.
Division Spotlight
Decommissioning & Environmental Sciences
The mission of the Decommissioning and Environmental Sciences (DES) Division is to promote the development and use of those skills and technologies associated with the use of nuclear energy and the optimal management and stewardship of the environment, sustainable development, decommissioning, remediation, reutilization, and long-term surveillance and maintenance of nuclear-related installations, and sites. The target audience for this effort is the membership of the Division, the Society, and the public at large.
Meeting Spotlight
2024 ANS Annual Conference
June 16–19, 2024
Las Vegas, NV|Mandalay Bay Resort and Casino
Standards Program
The Standards Committee is responsible for the development and maintenance of voluntary consensus standards that address the design, analysis, and operation of components, systems, and facilities related to the application of nuclear science and technology. Find out What’s New, check out the Standards Store, or Get Involved today!
Latest Magazine Issues
May 2024
Jan 2024
Latest Journal Issues
Nuclear Science and Engineering
June 2024
Nuclear Technology
Fusion Science and Technology
Latest News
Securing the advanced reactor fleet
Physical protection accounts for a significant portion of a nuclear power plant’s operational costs. As the U.S. moves toward smaller and safer advanced reactors, similar protection strategies could prove cost prohibitive. For tomorrow’s small modular reactors and microreactors, security costs must remain appropriate to the size of the reactor for economical operation.
Robert P. Keatch, Brian Lawrenson, F. Barrie Lewis, Tony C. Tyrrell
Fusion Science and Technology | Volume 35 | Number 2 | March 1999 | Pages 85-89
Technical Paper | doi.org/10.13182/FST99-A11963907
Articles are hosted by Taylor and Francis Online.
This paper describes the processes developed for “micromachining” novel, three-dimensional structures into silicon wafer substrates. The structural detail and dimensions required are similar to those encountered in the manufacture of integrated circuits and consequently, the techniques of oxidation, photolithography, wet, and dry etching, and vacuum deposition all have the potential for use in this area of microfabrication. Although the techniques described are primarily directed towards new processes for the production of miniature free-standing laser targets with varied surface profiles, these techniques are not limited to this, and can also be applied to areas such as microsensors and biomedical technology