This paper describes the processes developed for “micromachining” novel, three-dimensional structures into silicon wafer substrates. The structural detail and dimensions required are similar to those encountered in the manufacture of integrated circuits and consequently, the techniques of oxidation, photolithography, wet, and dry etching, and vacuum deposition all have the potential for use in this area of microfabrication. Although the techniques described are primarily directed towards new processes for the production of miniature free-standing laser targets with varied surface profiles, these techniques are not limited to this, and can also be applied to areas such as microsensors and biomedical technology