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Fusion Science and Technology
August 2026
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Uranium prices steady as EIA releases annual market report
The end-of-July spot price for uranium was $86.36 per pound, as reported by Cameco—roughly the same as it has been since February. Analytics firm Trading Economics reported a uranium futures price of $86.60 per pound, a figure that also has been holding steady since early April.
These updates come as the U.S. Energy Information Administration has released its 2025 Uranium Marketing Annual Report, which examines in detail multiple aspects of the U.S. uranium market. Data are derived from answers given in the Uranium Marketing Annual Survey, which collects information on contracts, deliveries (during the past year and projected for the next 10 years), purchased enrichment services, inventories, fuel assembly usage, and market requirements.
R. McEachern, C. Alford, R. Cook, D. Makowiecki, R. Wallace
Fusion Science and Technology | Volume 31 | Number 4 | July 1997 | Pages 435-441
Technical Paper | Eleventh Target Fabrication Specialists' Meeting | doi.org/10.13182/FST97-A30798
Articles are hosted by Taylor and Francis Online.
We have performed a series of preliminary experiments to determine whether sputter deposition of doped Be is a practical route to producing NIF target capsules with Be ablators. Films ranging in thickness from 7 to ∼120 µm have been deposited on spherical polymer mandrels using a bounce pan to ensure uniform coating. With no voltage bias applied to the pan, relatively porous coatings were formed that were highly permeable to hydrogen. The surface finish of these films ranged from ∼250 nm rms for 13-µm-thick films to a minimum of ∼75 nm rms for an 80-µm-thick film. Application of a voltage bias was found to significantly modify the film morphology. At a bias of 120 V, 7-µm-thick films with a dense, fine-grained microstructure were produced. These capsules had a reflective surface with a 50 nm rms roughness. Finally, to demonstrate the ability to produce a graded dopant profile, a coating was produced in which the concentration of added Cu was varied from 2.5 atom % at the beginning to zero after 40 µm of deposition.