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Tech giants and nuclear leaders make news at CERAWeek
Microsoft and Nvidia have formed an “AI for nuclear” partnership intended to streamline the permitting, design, and operations of nuclear power plant facilities, and highlighted the collaboration at CERAWeek 2026 in Houston earlier this week.
Microsoft said in an announcement that the collaboration will build a “connected, AI-powered foundation” of AI tools that energy developers will be able to use to make work “repeatable, traceable, secure, and predictable,” all the while reducing work timelines and maintaining safety.
T. A. Heltemes, G. A. Moses
Fusion Science and Technology | Volume 52 | Number 4 | November 2007 | Pages 927-931
Technical Paper | Inertial Fusion Technology: Drivers and Advanced Designs | doi.org/10.13182/FST07-A1612
Articles are hosted by Taylor and Francis Online.
The introduction of magnetic cusp fields into the High Average Power Laser (HAPL) reactor design is to prevent target ions from interacting with the armor layer. Diverting the ions and preventing their impact on the chamber armor eases thermal design constraints considerably. The BUCKY code was used to simulate thermal loads for the candidate armor materials tungsten and silicon carbide.Parametric analysis was done to ascertain the peak temperature rise in the armor due to X-rays from the HAPL target thermonuclear ignition. Temperature values as a function of chamber armor radius were obtained using initial conditions of T0 = 600 °C and xenon buffer gas pressures of 66.7, 666.7 and 6666.1 mPa (0.5, 5 and 50 mTorr). The armor radius was decreased until thermal thresholds were met (2400 °C and 1000 °C for tungsten and silicon carbide, respectively) to determine the minimum allowable radius of the HAPL chamber.A second set of parametric simulations were performed at xenon gas initial pressures of 666.7 and 6666.1 mPa (5 and 50 mTorr) and temperature of 600°C to a time of 5 ms to observe the effect of re-radiation from the buffer gas on the surface temperature of tungsten and silicon carbide.