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RELAP5-3D Multidimensional Heat Conduction Enclosure Model for RBMK Reactor Application

Seungho Paik

Nuclear Technology / Volume 128 / Number 1 / Pages 87-102

October 1999


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A heat conduction enclosure model is conceived and implemented by RELAP5-3D between heat structures. The suggested model uses a lumped parameter model that is generally applicable to multidimensional calculational domain. This new model is applied to calculation of RBMK reactor core graphite blocks and is compared to the commercially available Fluid Dynamics Analysis Package (FIDAP) finite element code. Reasonably good agreement between the results of RELAP5-3D and FIDAP is obtained. The new heat conduction enclosure model gives RELAP5-3D a general multidimensional heat conduction capability. It also provides new routes for temperature cooloff of the RBMK graphite blocks from the ruptured channel to the surrounding ones. This ability to predict graphite temperature cooloff is very important during accidents or for transient simulation, especially concerning long-term coolability of the RBMK reactor core.

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