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Fabrication and Plasma Exposure of Fine-Grained Tungsten/Copper Functionally Graded Materials in the HT-7 Tokamak

F. L. Chong, J. L. Chen, Z. J. Zhou, J. G. Li

Fusion Science and Technology / Volume 53 / Number 3 / Pages 854-859

April 2008

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Five-layered W/Cu functionally graded materials with fine grain sizes of 0.2, 1, and 7 m were fabricated by resistance sintering under ultrahigh pressure. Microstructure analysis found that they have a good graded composition distribution and mechanical properties. After about 2000 s edge plasma exposure in the HT-7 superconducting tokamak, the results indicated that the fine-grained tungsten can enhance mechanical strength, and it is favorable to hold back crack propagation and growth; however, the effects on impurity deposition and compound formation were not obvious.

 
 
 
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