Home / Store / Journals / Electronic Articles / Fusion Science and Technology / Volume 49 / Number 4
Keiji Nagai, Daisuke Wada, Mitsuo Nakai, Takayoshi Norimatsu
Fusion Science and Technology
Volume 49 / Number 4 / May 2006 / Pages 686-690
Format:electronic copy (download)
This paper deals with the fabrication of low-density metal using micro-template and electrochemical plating techniques. Tin and gold foam films were demonstrated. For both cases, porous foam plating required 0.5 V negatively higher bias potential than that for conventional metal plating. The electric current density values for them are smaller than those for bulk metal plating. In spite of these differences, the coulomb efficiency was almost the same as those for bulk metal plating. The density was almost close to the rest of closed packing density; 23 % of bulk metal for gold and 20 % of bulk metal for tin. These low-density foams will be applied for extreme ultraviolet (EUV) generation or other application through laser produced plasma.
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