The use of functionally graded layers (FGLs) for plasma facing components (PFCs), owing to moderate or piecewise transition in material properties from low-Z surface materials to metal substrates, can provide reduction in thermal stresses, and also provide high thermal load resistance to PFCs.1 This article deals with the comparison of high heat flux testing and thermal stress analysis results on PFCs. Thermal stress analyses confirmed the thermal loading test results.